Manufacture capability Layers: 1-16 layers Materials: CEM1, CEM3, Teflon, Rogers,FR-4, High Tg FR-4, Aluminum Base, Halogen Free Max. Board Size: 510*1200mm Material: RoHS Directive-compliant PCB thickness: 1.6 ±0.1mm Out Layer Copper Thickn
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Lead Time For Production Orders: Sample Lead time(days) Mass production lead time(days) Single sided PCB 1~3 4~7 Double si
Electronics Forum | Wed Apr 08 00:49:37 EDT 1998 | Steve Gregory
Well...I think we just about beat this one to death, but I'll go ahead and add a couple more points to "pro-score" camp...WITH the caveat that it HAS to be done right! Yes, I will say that I've had to deal with the wrong spec'd or crappy scor
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Embedded System: 8085 Microprocessor, 8051Microcontrollert, 16 bit Renesas Microcontroller, ARM7, UART, RS-232, IR Sensor, Hall Sensor, Fingerprint Module, RF Module, EEPROM and GSM. VLSI, VHDL. Software’s Knowledge: Keil3, Flash Magic, Prog5
